Display panel and manufacutring method thereof, display device

ABSTRACT

A display panel includes an under screen camera display area and a normal display area surrounding the under screen camera display area, a plurality of switch assemblies are positioned at the normal display area, and a plurality of sub-pixels are positioned at the under screen camera display area. The display panel includes an insulating layer group and a plurality of connection lines; a plurality of trenches are positioned on the insulating layer group and extend from the sub-pixels to the switch assemblies; and at least part of the connection lines is positioned in the trench to reduce spacing distance between two adjacent connection lines, where the connection lines are connected between the switch assemblies and the sub-pixels.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon, and claims the benefit of and priorityto, Chinese Patent Application No. 202011011545.4, filed Sep. 23, 2020,the entire contents of which are incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to the field of display technology and,particularly, to a display panel and a manufacturing method of thedisplay panel, and a display device including the display panel.

BACKGROUND

With the development of display technology, providing a camera under adisplay screen has become a new type of display technology, which canrealize the full screen display so as to increase screen-to-body ratioof a device.

Currently, however, light transmittance of the camera area of a displayscreen is relatively low, the pixel density is relatively low, and thesize of a camera which can be provided is relatively small.

Therefore, it is necessary to study a new display panel and amanufacturing method of the display panel and a display device includingthe display panel.

The foregoing information disclosed by the background section is onlyused to enhance the understanding of the background of the presentdisclosure, and therefore it may include information that does notconstitute the prior art known to those of ordinary skilled in the art.

SUMMARY

The object of the present disclosure is to provide a display panel ofwhich the pixel density is relatively high, a manufacturing method ofthe display panel and a display device including the display panel.

The additional aspects and advantages of the present disclosure will bepartially set forth in the following description, and will partiallybecome apparent from the description, or may be learned through practiceof the present disclosure.

According to an aspect of the present disclosure, there is provided adisplay panel, having an under screen camera display area and a normaldisplay area surrounding the under screen camera display area, aplurality of switch assemblies being positioned at the normal displayarea, and a plurality of sub-pixels being positioned at the under screencamera display area, where the display panel includes:

an insulating layer group, with a plurality of trenches being positionedthereon, and the trenches extend from the sub-pixels to the switchassemblies; and

a plurality of connection lines, where at least part of the connectionline is positioned in the trench to reduce a spacing distance betweentwo adjacent connection lines, and the connection line are connectedbetween the switch assemblies and the sub-pixels.

According to another aspect of the present disclosure, there is provideda manufacturing method of a display panel, the display panel having anunder screen camera display area and a normal display area surroundingthe under screen camera display area, where the manufacturing methodincludes:

forming a plurality of switch assemblies at the normal display area;

forming an insulating layer group at one side of the plurality of theswitch assemblies, and forming a plurality of trenches on the insulatinglayer group, where the trenches extend from the under screen cameradisplay area to the normal display area;

forming a plurality of connection lines, where at least part of theconnection lines is formed in the trench to reduce a spacing distancebetween two adjacent connection lines; and

forming a plurality of sub-pixels at one side of the insulating layergroup away from the switch assemblies, where the sub-pixels areconnected to the switch assemblies through the connection lines.

According to yet another aspect of the present disclosure, there isprovided a display device, including: a display panel according to anyone of the foregoing embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features and advantages of the presentdisclosure will become more apparent through describing the exemplaryembodiments thereof in detail with reference to the accompanyingdrawings.

FIG. 1 is a schematic top view of a display panel in the related art;

FIG. 2 is a schematic structural diagram of a display panel according toan exemplary embodiment of the related art;

FIG. 3 is a schematic structural diagram of a display panel according toanother exemplary embodiment of the related art;

FIG. 4 is a schematic structural diagram of a display panel according toa first exemplary embodiment of the present disclosure;

FIG. 5 is a schematic structural diagram of a display panel according toa second exemplary embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram of a display panel according toa third exemplary embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of a display panel according toa fourth exemplary embodiment of the present disclosure;

FIG. 8 is a schematic structural diagram of a display panel according toa fifth exemplary embodiment of the present disclosure;

FIG. 9 is a schematic flow chart illustrating a manufacturing method ofa display panel according to an exemplary embodiment of the presentdisclosure; and

FIG. 10 to FIG. 13 are schematic diagrams illustrating steps ofmanufacturing a display panel according to the third exemplaryembodiment of the present disclosure.

DETAILED DESCRIPTION

The exemplary embodiments will now be more fully described withreference to the accompanying drawings. However, the exemplaryembodiments can be implemented in various manners, and should not beunderstood as being limited to the embodiments set forth here. On thecontrary, these embodiments are provided so that the present disclosurewill be comprehensive and complete, and the conception of the exemplaryembodiments will be fully conveyed to those skilled in the art. Samereference numbers in the figures represent same or similar structures,and thus their detailed description will be omitted.

Referring to the schematic structural diagram of a display panelaccording to an exemplary embodiment of the related art shown in FIG. 1and FIG. 2, the display panel has an under screen camera display area 13and a normal display area 12 surrounding the under screen camera displayarea 13. In order to increase the light transmittance of the underscreen camera display area 13 and improve the imaging effect of thecamera, instead of a switch assembly 3, only a sub-pixel 18 ispositioned at the under screen camera display area 13. However, thesub-pixel 18 positioned at the under screen camera display area 13 alsoneeds to be controlled through the switch assembly 3. Therefore, thesub-pixel 18 and the switch assembly 3 need to be connected through aconnection line 7. However, if the pixel density at the under screencamera display area 13 is relatively large, which causes space betweenthe sub-pixels 18 to be relatively small, there may not be manyconnection lines 7 that can be accommodated for passing through.Therefore, there are not so many sub-pixels 18 that can be provided toincrease the pixel density. In addition, when a plurality of theconnection lines 7, which connect the sub-pixels 18 positioned at theunder screen camera display area 13 to the switch assemblies 3, arepositioned on a same planarization layer, wet etching is adopted as themanufacturing process of the connection lines 7. Limited by the processcondition of wet etching, a gap between two adjacent connection lines 7cannot be too small. Therefore, there may be not so many connectionlines 7 that can be provided in a certain area, thereby preventingenough pixels from being provided to increase the pixel density of theunder screen camera display area 13.

Referring to the schematic structural diagram of a display panelaccording to another exemplary embodiment of the related art shown inFIG. 3, in the exemplary embodiment, two adjacent connection lines 7 arepositioned at different layers so as to increase a gap between the twoadjacent connection lines 7 of the same layer. However, one layer ofthird planarization layer 53 needs to be added, and two etchingprocesses also need to be added. Therefore, the cost is greatlyincreased.

The present exemplary embodiments first provide a display panel.Referring to the schematic structural diagrams of display panels of thepresent disclosure shown in FIG. 4 to FIG. 8, a display panel isprovided with an under screen camera display area 13 and a normaldisplay area 12 surrounding the under screen camera display area 13. Aplurality of switch assemblies 3 are positioned at the normal displayarea 12, and a plurality of sub-pixels 18 are positioned at the underscreen camera display area 13. The display panel includes an insulatinglayer group and a plurality of connection lines 7. A plurality oftrenches 6 are positioned on the insulating layer group, where thetrenches 6 extend from the sub-pixel 18 to the switch assembly 3. Atleast part of the plurality of the connection lines 7 is positioned inthe trench 6 to reduce a spacing distance between two adjacentconnection lines 7, where the connection line 7 connects between theswitch assembly 3 and the sub-pixel 18.

Referring to FIG. 4, the display panel may include a base substrate 1,and the base substrate 1 may be a polyimide resin. Alternatively, inanother exemplary embodiment of the present disclosure, the basesubstrate 1 may be a glass substrate. A buffer layer 2 is positioned onthe base substrate 1.

A plurality of switch assemblies 3 are positioned at the normal displayarea 12 and the switch assembly 3 may be a top gate type TFT (Thin FilmTransistor). The specific structure of the switch assembly 3 may be asfollows. An active layer 31 is positioned at one side of the bufferlayer 2 away from the base substrate 1, a first gate insulating layer 32is positioned at one side of the active layer 31 away from the basesubstrate 1, and a first via is positioned on the first gate insulatinglayer 32, where the first via exposes the active layer 31. A gate 33 anda first electrode 41 of a capacitor are positioned at one side of thefirst gate insulating layer 32 away from the base substrate 1. A secondgate insulating layer 34 is positioned at one side of the gate 33 awayfrom the base substrate 1, and a second via communicated with the firstvia is positioned on the second gate insulating layer 34. A secondelectrode 42 of the capacitor is positioned at one side of the secondgate insulating layer 34 away from the base substrate 1, where thesecond electrode 42 of capacitor and the first electrode 41 of thecapacitor are positioned directly opposite. An interlayer dielectric 35is positioned at one side of the second electrode 42 of the capacitoraway from the base substrate 1, and a third via communicated with thefirst via is positioned on the interlayer dielectric 35. A source 36 anda drain 37 are positioned at one side of the interlayer dielectric 35away from the base substrate 1, where the source 36 and the drain 37 areconnected to the active layer 31 through the third via, the second via,and the first via. Alternatively, in another exemplary embodiment of thepresent disclosure, the switch assembly 3 may also be a bottom gate typeTFT, a double gates type TFT, or the like, which will not be elaboratedhere.

A first planarization layer 51 is positioned at one side of the source36 and the drain 37 away from the base substrate 1, and a fourth via 11is positioned on the first planarization layer 51. A secondplanarization layer 52 is positioned at one side of the firstplanarization layer 51 away from the base substrate 1.

The first gate insulating layer 32, the second gate insulating layer 34,the interlayer dielectric 35, the first planarization layer 51, and thesecond planarization layer 52 all extend to the under screen cameradisplay area 13.

A plurality of trenches 6 are positioned on the first planarizationlayer 51, where the trench 6 extends from the under screen cameradisplay area 13 to the normal display area 12. One of the two adjacentconnection lines 7 is positioned in the trench 6, and the other one ispositioned at one side of the first planarization layer 51 away from thebase substrate 1. The connection line 7 also extends from the underscreen camera display area 13 to the normal display area 12. Material ofthe connection line 7 is indium tin oxide (ITO) or tin-doped indiumoxide. Alternatively, the material of the connection line 7 may also beother transparent conductive material.

As can be seen from FIG. 4, a distance between the two adjacentconnection lines 7 is L, a spacing distance between the two adjacentconnection lines 7 is A, a difference in height between the two adjacentconnection lines 7 is H, where the difference in height is depth of thetrench 6, and L=(A²+H²)^(1/2), L>A. Since there is the difference inheight H between the two adjacent connection lines 7, in the case that asame pixel density is ensured, the distance L between the two adjacentconnection lines 7 can be increased, thereby being beneficial toimproving the process capability. Similarly, when the distance L underthe process capability is reached, the spacing distance A between thetwo adjacent connection lines 7 can be decreased, so that the spacingdistance between pixels can be reduced, thereby increasing the pixeldensity or increasing size of the camera. Moreover, L is proportional toH, and the greater the depth of the trench 6, the greater the distance Lbetween the two adjacent connection lines 7 can be made. In the casethat L is kept unchanged, the larger H is, the smaller A can be.Therefore, as long as allowed by the process design, the larger thedepth of the trench 6 is designed, the more beneficial to increasing thepixel density it is.

The second planarization layer 52 covers one side of the connection line7 away from the base substrate 1, and a fifth via is positioned on thesecond planarization layer 52. A first electrode 9 is positioned at oneside of the second planarization layer 52 away from the base substrate1. At the normal display area 12, the first electrode 9 is connected tothe source 36 or the drain 37 through the fifth via and the fourth via11. At the under screen camera display area 13, the first electrode 9 isconnected to the connection line 7 through the fifth via, therebyconnecting the sub-pixel 18 to the connection line 7. The connectionline 7 is then connected to the switch assembly 3 positioned at thenormal display area 12, thereby connecting the switch assembly 3 and thesub-pixel 18 through the connection line 7. Through the switch assembly3 positioned at the normal display area 12, the sub-pixel 18 positionedat the under screen camera display area 13 can be controlled.

A pixel defining layer 8 is positioned on the first electrode 9. A sixthvia is positioned on the pixel defining layer 8 to expose the firstelectrode 9. A light emitting layer 10 is positioned in the sixth via,where the light emitting layer 10 is connected with the first electrode9. A second electrode (not shown in the figure) is positioned at oneside of the light emitting layer 10 away from the base substrate 1.

In the exemplary embodiment, the first electrode 9 is an anode and thesecond electrode is a cathode.

Referring to the schematic structural diagram of a display panelaccording to a second exemplary embodiment of the present disclosureshown in FIG. 5, structure of a normal display area 12 in the exemplaryembodiment is identical to the structure of the normal display area 12in the first exemplary embodiment, which is not repeatedly describedhere. The main difference between the exemplary embodiment and the firstexemplary embodiment lies in that a trench wall of the trench 6 isprovided in in a stepped shape.

In the exemplary embodiment, a trench 6 is positioned on a firstplanarization layer 51. The trench 6 penetrates downwards through thefirst planarization layer 51 to an interlayer dielectric 35. Two trenchwalls of the trench 6 are both provided with one step, and extendingdirection of the step is consistent with extending direction of thetrench 6, so that one side of the trench 6 forms three step surfaces 61,i.e., there are totally three step surfaces, namely, the step surfaces61 on a trench bottom and a trench wall and one side of the firstplanarization layer 51 away from the base substrate 1, where the trenchbottom is shared by two sides, so the trench walls of two sides of thetrench 6 include five step surfaces 61. Among the five connection lines7, the connection line 7 located most central is positioned at thetrench bottom of the trench 6, i.e., the connection line 7 located mostcentral is positioned at one side of the interlayer dielectric 35 awayfrom the base substrate 1. The connection lines 7 located at the twosides are positioned at one side of the first planarization layer 51away from the base substrate 1. The rest two connection lines 7 arerespectively positioned on the step surfaces 61 of the steps. The stepsurface on the trench wall may be formed through masking with atranslucent mask and then etching.

Alternatively, in another exemplary embodiment of the presentdisclosure, in the case that a trench 6 does not penetrate through afirst planarization layer 51, a side wall of the trench 6 may also beprovided in a stepped shape, and a connection line 7 may be positionedon a step surface 61. The number of steps may also be set according toactual needs and an allowed thickness of the first planarization layer51. In addition, the trench 6 is not necessarily positioned on the firstplanarization layer 51, but also can be provided on a passivation layer16 or the interlayer dielectric 35.

Through the exemplary embodiments, the pixel density of the under screencamera display area 13 can be increased, or a camera with a relativelylarge size can be selected, and the principle thereof is identical tothe principle described in the first exemplary embodiment, which is notrepeatedly described here.

Referring to the schematic structural diagram of a display panelaccording to a third exemplary embodiment of the present disclosureshown in FIG. 6, the structure of a normal display area 12 in theexemplary embodiment is identical to the structure of the normal displayarea 12 in the first exemplary embodiment, which is not repeatedlydescribed here. The main difference between the exemplary embodiment andthe first exemplary embodiment lies in that connection lines 7 are allprovided in a trench 6.

In the exemplary embodiment, a plurality of trenches 6 are positioned ona first planarization layer 51 and all penetrate downwards through thefirst planarization layer 51 to an interlayer dielectric 35. A materialof the first planarization layer 51 may be resin, and the trench 6formed by etching is an inverted trapezoid with an opening width Kgreater than a trench bottom width D. A length direction of the trenchis consistent with extending direction of the trench and a widthdirection thereof is substantially perpendicular to the lengthdirection. Connection lines 7 are all positioned in the trench 6, andlocated at one side of the interlayer dielectric 35 away from a basesubstrate 1. The first planarization layer 51 between the two adjacenttrenches 6 forms an isolation part of the connection line 7.

Referring to the schematic structural diagram of a display panelaccording to a fourth exemplary embodiment of the present disclosureshown in FIG. 7, a structure of a normal display area 12 in theexemplary embodiment is identical to the structure of the normal displayarea 12 in the first exemplary embodiment, which is not repeatedlydescribed here. The main difference between the exemplary embodiment andthe third exemplary embodiment lies in that material of a firstplanarization layer 51 is negative photoresist 15, and a trench 6 formedby etching is a trapezoid with an opening width K smaller than a trenchbottom width D. A length direction of the trench is consistent withextending direction of the trench and a width direction thereof issubstantially perpendicular to the length direction.

Referring to the schematic structural diagram of a display panelaccording to a fifth exemplary embodiment of the present disclosureshown in FIG. 8, a structure of a normal display area 12 in theexemplary embodiment is identical to the structure of the normal displayarea 12 in the first exemplary embodiment, which is not repeatedlydescribed here. The main differences between the exemplary embodimentand the third exemplary embodiment lie in that, there is a passivationlayer 16 positioned at one side of a source 36 and a drain 37 away froma base substrate 1, and a fourth via 11 is positioned on the passivationlayer 16. A second planarization layer 52 is positioned at one side ofthe passivation layer 16 away from the base substrate 1. In other words,the passivation layer 16 is used to replace the first planarizationlayer 51 in the third exemplary embodiment. Material of the passivationlayer 16 may be silicon oxide, silicon nitride, or silicon oxynitride,or may also be a layered structure formed by two or three of siliconoxide, silicon nitride, and silicon oxynitride. A plurality of trenches6 are positioned on the passivation layer 16, and a connection lines 7are all positioned in the trench 6.

Further, the present disclosure also provides a manufacturing method ofa display panel, where the display panel is provided with an underscreen camera display area 13 and a normal display area 12 surroundingthe under screen camera display area 13. Referring to the flow chartillustrating a manufacturing method of a display panel according to thepresent disclosure shown in FIG. 9. The manufacturing method of thedisplay panel may include following steps.

In step S10, a plurality of switch assemblies 3 is formed at the normaldisplay area 12.

In step S20, an insulating layer group is formed at one side of theplurality of the switch assemblies 3, and a plurality of trenches 6 areformed on the insulating layer group, where the trench 6 extends fromthe under screen camera display area 13 to the normal display area 12.

In step S30, a plurality of the connection lines 7 are formed, where atleast part of the connection lines is formed in the trench 6 to reduce aspacing distance between two adjacent connection lines 7.

In step S40, a plurality of sub-pixels 18 are formed on one side of theinsulating layer group away from the switch assembly 3, where thesub-pixel 18 is connected to the switch assembly 3 through theconnection line 7.

In the exemplary embodiment, referring to FIG. 10, after the pluralityof switch assemblies 3 are formed at the normal display area 12, a firstplanarization layer 51 is formed at one side of a source 36 and drain 37away from a base substrate 1, and a trench 6 and a fourth via 11 areformed on the first planarization layer 51, where the trench 6 extendsfrom an under screen camera display area 13 to a normal display area 12,and the fourth via 11 exposes the source 36.

Referring to FIG. 11, a line material layer 17 is formed at one side ofa first planarization layer 51 away from a base substrate 1, where thefirst planarization layer 51 is covered by the line material layer 17thereon, a trench 6 is covered by the line material layer 17 therein anda fourth via 11 is covered by the line material layer 17 therein.

Referring to FIG. 12, photoresist 14 is formed at one side of a linematerial layer 17 away from a base substrate 1, and exposure process isperformed to remove the photoresist 14 on a first planarization layer 51and in a fourth via 11, with the photoresist 14 in a trench 6 beingretained.

Referring to FIG. 13, a line material layer 17 is etched usingphotoresist 14 as a mask, and the line material layer 17 in a trench 6is retained so as to form a connection line 7.

In the etching process of forming a connection line 7 in the related artin FIG. 1, since the line material layer 17 is formed on the upper planeof a first planarization layer 51, after photoresist 14 is formed on theline material layer 17 and exposed, one trench will be formed betweenthe photoresist 14. Etching applied to the line material layer 17 at thebottom of the trench not covered by the photoresist 14 may result inincomplete replacement, so a spacing distance between the connectionlines 7 needs to be enlarged so that complete etching can be ensured.While in the exemplary embodiment, the line material layer 17 whichneeds to be etched is positioned on the upper plane of the firstplanarization layer 51, which is prominent relative to the photoresist14. Therefore, the result of incomplete replacement will not beproduced, and the spacing distance A between the connection lines 7 doesnot need to be enlarged. The spacing distance A between the connectionlines 7 depends on the exposure process. As long as being allowed by theexposure process, the smaller the spacing distance A between connectionlines 7, the better. The smaller the spacing distance A, the morequantities of the connection lines 7 can be positioned within a certainrange of size, so that more sub-pixels can be provided to increase thepixel density, or a larger camera can be provided. The line materiallayer 17 of the trench wall of the trench 6 may be fully retained. Sincethere is the first planarization layer 51 being used as an isolationpart, other problem such as short circuit and the like will not arise,thereby increasing width of the connection line 7 and reducingresistance of the connection line 7, which is beneficial to reducing thepower consumption.

Further, the present disclosure also provides a display device, wherethe display device may include any of the foregoing display panels. Thespecific structure of the display panel has been described in detailhereinabove, therefore, which is not repeatedly described here.

Specific type of the display device is not particularly limited. Anytype of display device commonly used in the art will do, for example,other mobile device such as a mobile phone and the like, other wearabledevice such as a watch and the like and a VR device, etc. Those skilledin the art may select accordingly according to the specific purpose ofthe display device, which is not repeatedly described here.

It should be noted that, in addition to a display panel, the displaydevice also includes other necessary component and composition, taking adisplay as an example, specifically for example, a housing, a circuitboard and a power cord, etc. Those skilled in the art may make acorresponding supplement according to the specific usage requirement ofthe display device, which is not repeated described here.

Compared with the prior art, the beneficial effect of a display deviceprovided by an exemplary embodiment of the present disclosure isidentical to the beneficial effect of a display panel provided by theforegoing exemplary embodiments, which is not repeatedly described here.

It may be understood based on the foregoing technical solutions that thepresent disclosure has at least one of the following advantages andpositive effects.

According to the display panel of the present disclosure, a plurality oftrenches are provided on an insulating layer group, where the trenchesextend from a sub-pixel to a switch assembly; at least part of theconnection lines is positioned in the trench to reduce a spacingdistance between two adjacent connection lines, so that relatively largenumber of connection lines can be provided within a certain size ofarea, and thus relatively large number of sub-pixels can be provided atan under screen camera display area. The sub-pixels may be connected tothe switch assemblies positioned at a normal display area through theconnection lines, and the control of the sub-pixels can be achievedthrough the switch assemblies, thereby increasing the pixel density ofthe under screen camera display area. Also, a camera of a relativelylarge size can be provided.

The features, structures or characteristics of the forgoing descriptionmay be combined into one or more embodiments in any suitable manner. Ifpossible, the features discussed in the various embodiments areinterchangeable. In the above description, many specific details areprovided thereby giving a sufficient understanding of the embodiments ofthe present disclosure. However, those skilled in the art will realizethat the technical solution of the present disclosure may be practicedwithout one or more of the specific details. Alternatively, othermethods, assemblies, and material, etc., may be used. In other cases,well-known structure, material, or operations are not shown or describedin detail to avoid obscuring aspects of the present disclosure.

Although relative terms are used in the present specification, forexample “above” and “below”, to describe a relative relationship of oneassembly of an icon to another assembly, these terms are used forconvenience only in the present specification, for example, according todirection of an example described in the figures. It can be understoodthat if a device of an icon is turned over and caused upside down, anassembly “above” described will become an assembly “below”. Otherrelative terms, for example, “high”, “low”, “top” and “bottom”, etc.,all have similar meanings. When a certain structure is “on” otherstructure, it may be referred that the certain structure is integrallyformed onto other structure, or that the certain structure is “directly”positioned on other structure, or that the certain structure is“indirectly” positioned on other structure through another structure.

In the present specification, the terms “a”, “an”, “the” and “said”being used to indicate that there are one or more elements/constituentparts/etc.; the terms “include”, “comprise” and “have” being used toindicate the meaning of open-ended inclusion and referring that inaddition to the listed element/constituent part/etc., there may also beadditional element/constituent part/etc.; and the terms “first”,“second” and “third” only being used as markers and not being a limit onthe number of objects.

It is to be understood that the present disclosure does not limit anapplication thereof to the detailed structure and arrangement manner ofa component proposed by the present specification. The presentdisclosure can have other embodiment, and can be implemented andexecuted in various manners. The foregoing variation and modificationfall within the scope of the present disclosure. It is to be understoodthat the present disclosure disclosed and defined by the presentspecification extends to all alternative combinations of two or morethan two individual features mentioned or apparent herein and/or in thefigures. All these different combinations constitute multiplealternative aspects of the present disclosure. The embodiments describedby the present specification illustrate the best manner known forimplementing the present disclosure, and will enable those skilled inthe art to use the present disclosure.

What is claimed is:
 1. A display panel, comprising: an under screen camera display area and a normal display area surrounding the under screen camera display area, a plurality of switch assemblies being positioned at the normal display area, and a plurality of sub-pixels being positioned at the under screen camera display area; an insulating layer, with a plurality of trenches being positioned thereon, and the trenches extending from the sub-pixels to the switch assemblies; and a plurality of connection lines, wherein at least part of the connection lines is positioned in the trenches, and the connection lines are connected between the switch assemblies and the sub-pixels.
 2. The display panel according to claim 1, wherein a difference in height exists between at least two adjacent connection lines.
 3. The display panel according to claim 2, wherein one of any two adjacent connection lines is positioned in the trenches, and a remaining one of the any two adjacent connection lines is positioned on one surface of the insulating layer group.
 4. The display panel according to claim 2, wherein a trench wall of the trenches is provided with a step to form a plurality of step surfaces on the insulating layer, and extending direction of the step is consistent with extending direction of the trenches.
 5. The display panel according claim 4, wherein any two adjacent connection lines are positioned on different step surfaces.
 6. The display panel according to claim 1, wherein an isolation part formed by the insulating layer is provided between at least two adjacent connection lines.
 7. The display panel according to claim 6, wherein a material of the first insulating layer is negative photoresist and the trenches are provided as a trapezoid with an opening width smaller than a trench bottom width.
 8. The display panel according to claim 6, wherein the first insulating layer is a planarization layer or a passivation layer, and the trenches are provided as an inverted trapezoid with an opening width greater than a trench bottom width.
 9. The display panel according to claim 6, wherein the plurality of connection lines are positioned in the trenches.
 10. A manufacturing method of a display panel having an under screen camera display area and a normal display area surrounding the under screen camera display area, comprising: forming a plurality of switch assemblies at the normal display area; forming an insulating layer at one side of the plurality of switch assemblies, and forming a plurality of trenches on the insulating layer, wherein the trenches extend from the under screen camera display area to the normal display area; forming a plurality of connection lines, wherein at least part of the connection lines is formed in the trenches; and forming a plurality of sub-pixels at one side of the insulating layer away from the switch assemblies, wherein the sub-pixels are connected to the switch assemblies through the connection lines.
 11. A display device comprising a display panel, the display panel comprising: an under screen camera display area and a normal display area surrounding the under screen camera display area, a plurality of switch assemblies being positioned at the normal display area, and a plurality of sub-pixels being positioned at the under screen camera display area, wherein the display panel comprises: an insulating layer, with a plurality of trenches being positioned thereon, and the trenches extending from the sub-pixels to the switch assemblies; and a plurality of connection lines, wherein at least part of the connection lines is positioned in the trenches, and the connection lines are connected between the switch assemblies and the sub-pixels.
 12. The display device according to claim 11, wherein a difference in height exists between at least two adjacent connection lines.
 13. The display device according to claim 12, wherein one of any two adjacent connection lines is positioned in the trenches, and a remaining one of the two adjacent connection lines is positioned on one surface of the insulating layer group.
 14. The display device according to claim 12, wherein a trench wall of the trenches is provided with a step to form a plurality of step surfaces on the insulating layer, and extending direction of the step is consistent with extending direction of the trenches.
 15. The display device according claim 14, wherein any two adjacent connection lines are positioned on different step surfaces.
 16. The display device according to claim 11, wherein an isolation part formed by the insulating layer is provided between at least two adjacent connection lines.
 17. The display device according to claim 16, wherein material of the first insulating layer is negative photoresist and the trenches are provided as a trapezoid with an opening width smaller than a trench bottom width.
 18. The display device according to claim 16, wherein the first insulating layer is a planarization layer or a passivation layer, and the trenches are provided as an inverted trapezoid with an opening width greater than a trench bottom width.
 19. The display device according to claim 16, wherein the plurality of connection lines are positioned in the trenches. 